Huawei's upcoming flagship chip, built on innovative 3D IC stacking and the proprietary Tau Law, achieves performance parity with TSMC's 3nm process while bypassing EUV lithography constraints.
To be perfectly honest, I’d love to see someone actually challenge Apple on this front.
But I’ve been hearing the same shit year after year for like 15+ years. It would be good for the industry if the claims actually paned out for once. There’s no “coping” about it. Just simple truth…
To be perfectly honest, I’d love to see someone actually challenge Apple on this front.
But I’ve been hearing the same shit year after year for like 15+ years. It would be good for the industry if the claims actually paned out for once. There’s no “coping” about it. Just simple truth…
the simple truth is that you haven’t actually used a modern Huawei phone
Okay?
I’ve played around with them but yeah haven’t committed to one as my daily. Why would this be relevant in the topic of conversation?
Performance claims, that can be measured and tested, are being made. These claims always fall short and if past is prologue, this will be the same.
Love how you can’t actually argue against what I’ve said and resort to saying “you’ve never used one” lmao gtfo of here with this shit.